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| d a t a sh eet preliminary speci?cation file under integrated circuits, ic11 1999 apr 20 integrated circuits TEA1566 greenchip ? ; smps module
1999 apr 20 2 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 features distinctive features high level of integration results in 20 to 50 fewer components compared to a power supply with discrete components on-chip 600 v mosfet on/off function replaces expensive mains switch with functional switch direct off-line operation (90 to 276 vac) on-chip 5% accurate oscillator. green features low power consumption in off-mode (<100 mw) on-chip efficient start-up current source giving fast start-up burst mode stand-by (<2 w) for overall improved system efficiency low power operation mode with lower frequency to reduce switching losses. protection features demagnetization protection cycle by cycle current limitation with programmable current trip level over voltage protection over temperature protection safe-restart mode with reduced power for system fault conditions. highly versatile usable in buck and flyback topology interfaces both primary and secondary side feedback. applications general description the greenchip ? , intended for off-line 90 to 276 vac power supply applications, is a monolithic high voltage family of ics that combines analog and digital circuits to implement all necessary control functions for a switched mode power supply. the functions include integrated high voltage start-up current source, voltage mode pwm control, 5% accurate trimmed oscillator, band gap derived reference voltages, comprehensive fault protection, and leading edge blanking. high level of integration leads to cost effective power supplies that are compact, weigh less, and at the same time give higher efficiency, are more reliable and simple to design. efficient green features lead to very low power operation modes and a novel on/off function helps replace the expensive mains switch with a low cost functional switch. fig.1 typical flyback application. mgr691 TEA1566 mains 9 vin nc oob dem gnd vctrl iref vaux isense 8 7 6 5 4 3 2 1 output 1999 apr 20 3 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 ordering information block diagram type number package name description version TEA1566s sil9p plastic single in-line power package; 9 leads sot131-2 TEA1566j dbs9p plastic dil-bent-sil power package; 9 leads (lead length12 mm) sot157-2 fig.2 block diagram. handbook, full pagewidth start-up current source mgr692 burst mode stand-by on/off sample and hold1 sample and hold2 vaux management vaux demagnetization management oscillator over temperature protection over current protection leading edge blanking frequency control negative clamp error amplifier driver stage power mosfet pwm comparator vin iref nc isense oob vctrl q r 81 9 2 3 7 5.5 v 4 6 s dem gnd 5 TEA1566 6 w 1 k w 1999 apr 20 4 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 pinning functional description the greenchip ? family of ics are highly integrated, with most common pwm functions like error amplifier, oscillator, bias current generator, and band gap based reference voltage circuits fully integrated in the ics. high level of integration leads to easy and cost effective design of power supplies.the ics have been fabricated in a philips proprietary high voltage bcdmos process that enables devices of up to 720 v to be fabricated on the same chip with low voltage circuitry. symbol pin description isense 1 programmable current sense resistor vaux 2 ic supply capacitor iref 3 reference resistor for setting internal reference currents vctrl 4 feedback voltage for duty cycle control gnd 5 ground dem 6 demagnetization input signal from primary side auxiliary winding oob 7 on/off/burst mode input signal nc 8 not connected vin 9 mosfet drain connection fig.3 pin configuration. handbook, halfpage isense vaux iref vctrl gnd dem oob nc vin 1 2 3 4 5 6 7 8 9 TEA1566 mgr693 an efficient on-chip start-up circuit enables fast start-up and dissipates negligible power after start up. on-chip accurate oscillator generates a saw tooth waveform which is used by the voltage mode feedback control circuitry to generate a pulse width modulated signal for driving the gate of the power mosfet. a novel regulation scheme is used to implement both primary and secondary side regulation to minimize external component count. protection features like over voltage, over current, over temperature, and demagnetization protection, give comprehensive safety against system fault conditions. the greenchip ? offers some advanced features that greatly enhance the efficiency of the overall system. off-mode reduces the power consumption of the ic below 100 mw. burst mode stand-by reduces the power consumption of the system to below 2 w. low power operation mode reduces the operating frequency of the system, when the system is working under low load conditions, to reduce the switching losses. start-up current source and vaux management a versatile on-chip start-up current source makes an external, highly dissipating, trickle-charge circuit unnecessary. see fig.2 for the block diagram of the ic. the start-up current source derives power from the mains via pin vin (drain). it supplies current (see symbols istart-low and istart-high of chapter characteristics) to charge the vaux (ic supply) capacitor and at the same time provides current to the control circuitry of the ic. once the vaux capacitor is charged to its start-up voltage level (11 v), the on-chip oscillator starts oscillating and the ic starts switching the power mosfet. power is then supplied to the load capacitor via the secondary winding. figure 1 shows a typical flyback application diagram. the vaux capacitor is also supplied by an auxiliary winding on the primary side. this winding is coupled to the secondary side winding supplying the output capacitor. as the output capacitor voltage increases and approaches its nominal value, the re-supply of the vaux capacitor is done by the auxiliary winding. figure 4 shows relevant waveforms at start-up. for successful take over of supply of vaux capacitor by the auxiliary winding, it is important that the re-supply of vaux capacitor starts before its voltage drops to its under voltage lockout (uvlo) level of 8.05 v of the system and stops delivering power to the output. 1999 apr 20 5 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 in case of output short circuit, the vaux capacitor is no longer supplied by the auxiliary winding and its voltage drops till it reaches the uvlo level. if the output is an open circuit, the output voltage will rise till it reaches the over voltage protection (ovp) level. the ic will detect this state and stop switching. in absence of switching of the power device, the vaux capacitor will not be re-supplied and its voltage will drop till it reaches uvlo level. once the vaux voltage drops to uvlo level, the start-up current source is re-activated and it charges the vaux capacitor to its start level and the system goes through a cycle similar to the start-up cycle. figure 5 shows the relevant waveforms during safe-restart mode. the charging current (see symbol irestart-prot in chapter characteristics) from the start-up circuit during the safe-restart mode is lower than the normal start-up current (see symbol istart-high in chapter characteristics) in order to implement a low hiccup duty cycle. this helps insure devices on the output secondary winding do not get destroyed during output short circuit, violating safety conditions. the start-up current source also plays a key role in implementation of burst mode stand-by (see symbol irestart-stby in chapter characteristics), which will be explained later. fig.4 normal start-up waveforms. mgr694 t t (2) (1) 11 v 8.05 v vaux vout t vgate switching off (1) start-up current charges capacitor v aux . (2) charging of capacitor v aux is taken-over by the auxiliary winding. fig.5 safe-start mode waveforms. handbook, full pagewidth mgr695 t t fault condition switching off (1) normal operation vaux vgate (1) start-up current source charges capacitor v aux . 1999 apr 20 6 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 reference all reference voltages are derived from a temperature compensated, on-chip, band gap. the band gap reference voltage is also used, together with an external resistor connected at pin iref, to generate accurate, temperature independent, bias currents in the chip: [a] the frequency of the controller is also set by the reference resistor rref (also see section oscillator). sample and hold greenchip ? ics employ voltage mode feedback for regulating the output voltage. in primary feedback mode, a novel sample and hold circuit is used. the sample and hold circuit works by sampling the current into pin dem, which is related to the output voltage via rdem, during the time that the secondary current is flowing: a v out =i ref r dem +v dem+ where: v dem+ is specified in chapter characteristics a = a constant determined by turn ratio of the transformer. this sampled current information is stored on the external capacitor connected to pin vctrl. the pulse width modulator uses this voltage information to set the duty cycle of operation for the power mosfet. in secondary feedback, the feedback voltage is provided by an opto-coupler. pulse width modulator the pulse width modulator, which is made up of an inverting error amplifier and a comparator (see fig.2), drives the power mosfet with a duty cycle which is inversely proportional to the voltage on pin vctrl. in primary feedback mode, this is the voltage on the sample and hold capacitor and in secondary feedback mode, this voltage is provided by an opto-coupler. a signal from the oscillator sets a latch that turns on the power mosfet. the latch is reset by the signal from the pulse width modulator or by the duty cycle limiting circuit. the latching pwm mode of operation prevents multiple switching of the power switch. the maximum duty cycle is set internally at 80%. figure 7 shows the normal switching operation of the ic. i ref v ref r ref ------------- - = oscillator the oscillator is used to set the switching duty cycle by comparing the oscillator ramp to the output of the error amplifier in the pulse width modulator circuit.the oscillator is fully integrated and works by charging and discharging an internal capacitor between two voltage levels to create a sawtooth waveform with a rising edge which is 80% of the oscillator cycle. this ratio is used to set a maximum switching duty cycle of 80% for the ic. the oscillator is internally trimmed to 5% accuracy. the oscillator frequency can be adjusted between 50 to 100 khz (see symbol f osc-h-range in chapter characteristics) by changing the external reference resistor (see symbol rref in chapter characteristics) that sets the chip bias currents. this gives additional flexibility to the power supply designer in the choice of his system components.the frequency is correlated with the value of the reference resistor rref (see fig.6). in chapter characteristics f osc-typical , f osc-l and f osc-h and the rref operating resistor range are specified. fig.6 frequency as function of the r ref value. handbook, halfpage 10 20 30 40 110 90 50 30 70 mgr936 r ref (k w ) high frequency (khz) 55 45 25 15 35 low frequency (khz) (2) (1) (1) high frequency mode. (2) low frequency mode. 1999 apr 20 7 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 multi frequency control the oscillator is also capable of working at a lower frequency (see f osc-l in chapter characteristics). a ratio of 1 : 2.5 is maintained between high and low frequency of the oscillator. low frequency operation is invoked if the power supply is working at or below one ninth of its peak power. by working at a lower frequency, the switching losses in the power supply are reduced. a novel scheme is used to ensure that the transfer of high to low frequency and vice versa has no effect on the regulation of the output voltage. gate driver the gate driver has a totem-pole output stage that has current sourcing capability of 120 ma and a current sink capability of 550 ma. this is to enable fast turn on and turn off of the power device for efficient operation. a lower driver source current has been chosen in order to limit the d v/ d t at switch-on. this is advantageous for emi (electromagnetic interference) and reduces the current spike across rsense. demagnetization protection this feature guarantees discontinuous conduction mode operation for the power supply which simplifies the design of feedback control and gives faster transient response. demagnetization protection is an additional protection feature that protects against saturation of the transformer/inductor. demagnetization protection also protects the power supply components against excessive stresses at start-up, when all energy storage components are completely discharged. the converter is cycle by cycle protected during shorted output system fault condition due to the demagnetization protection. the value of the demagnetization resistor (r dem ) can be calculated with the formula given in section sample and hold. negative clamp the negative clamp circuit does not let the voltage on pin dem go below - 0.4 v, when the auxiliary winding voltage goes negative during the time that the power device is turned on, to ensure correct operation of the ic. over voltage protection an over voltage protection (ovp) mode has been implemented in the greenchip ? series. this circuit works by sensing the vaux voltage. if the output voltage exceeds the preset voltage limit, the ovp circuit turns off the power mosfet. with no switching of the power device, the vaux capacitor is not re-supplied and discharges to uvlo level and the system goes into the low dissipation safe-restart mode described earlier. the system recovers from the safe-restart mode only if the ovp condition is removed. over current protection cycle by cycle over current protection (ocp) is provided by sensing the voltage on an external resistor which is connected to the source of the power mosfet. the voltage on the current sense resistor, which reflects the amplitude of the primary current, is compared internally with a reference voltage using a high speed comparator. this threshold voltage is specified as v th(imax) in the chapter characteristics. the maximum primary (protection) current is therefore: [a] if the power device current exceeds the current limit, the comparator trips and turns off the power device. the power device is typically turned off in 210 ns (see t d in chapter characteristics). the availability of the current sense resistor off-chip for programming the ocp trip level increases design flexibility for the power supply designer. an off-chip current sense resistor also reduces the risk of an ocp condition being sensed incorrectly. at power mosfet turn-on the d v/ d t limiters capacitance discharge current does not have to flow through the sense resistor, because this capacitor can be connected between drain and source of the power mosfet directly. the leading edge blanking (leb) circuit works together with the ocp circuit and inhibits the operation of the ocp comparator for a short duration (see t leb in chapter characteristics) when the power device is turned on. this ensures that the power device is not turned off prematurely due to false sensing of an ocp condition because of current spikes caused by discharge of primary-side snubber and parasitic capacitances. leb time is not fixed and it tracks the oscillator frequency. i prot v th imax () r sense ------------------------ = 1999 apr 20 8 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 over temperature protection protection against excessive temperature is provided by an analog temperature sensing circuit that turns off the power device when the temperature exceeds typically 140 c. on/off mode the expensive mains switch can be replaced by an in-expensive functional switch by using the on/off mode. figure 13 shows a flyback converter configured to use the on/off mode. depending upon the position of switch s1, either voltage close to ground or a voltage of greater than typical 2.5 v exists on pin oob. the difference between these voltages is detected internally by the ic. the ic goes into the off-mode if the voltage is low, where it consumes a current of typical 350 m a (see iin-off in chapter characteristics). if the voltage on pin oob is typically 2.5 v (see von/off in chapter characteristics), the ic goes through the start-up sequence and commences normal operation. in fig.14 a mains under voltage lock out (muvlo) function has been created using 3 resistors. assuming that r3 is chosen very high ohmic, the greenchip? starts operating if: in this way it is assured that the power supply only starts working above a vmains of e.g. 80 v. the bleeder current through r1 should be low (e.g. 30 m a at 300 v). v mains r1 r2 ------- - v oob r1 r2 ? () ? burst mode stand-by pin oob is also used to implement the burst mode stand-by. in burst mode stand-by, the power supply goes into a special low dissipation state where it typically consumes less than 2 w of power. figure 14 shows a flyback converter using the burst mode stand-by feature. the system enters burst mode when the microcontroller closes switches s2 and s3 on the secondary side. switch s2 shorts the output capacitor to the voltage level of the microcontroller capacitor. the output secondary winding now supplies the microcontroller capacitor. when the voltage on the microcontroller capacitor exceeds the zener voltage (v z ) the opto-coupler is activated which sends a signal to pin oob. in response to this signal, the ic stops switching and goes into a hiccup mode. figure 7 shows the burst-mode operation graphically. the hiccup mode during burst mode operation differs from the hiccup in safe-restart mode during system fault. for safe restart mode, the power has to be reduced. for burst mode, sufficient power to supply the microcontroller has to be delivered. to prevent transformer rattle, the transformer peak current is reduced by a factor of 3. burst mode stand-by operation continues till the microcontroller opens switches s2 and s3. the system then goes through the start-up sequence and commences normal switching behaviour. 1999 apr 20 9 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 handbook, full pagewidth vin vin vdrain vout vaux vgate iaux burst mode v m p 0 (1) start up sequence normal operation normal operation over voltage protection output short circuit burst mode stand-by mgr696 fig.7 typical waveforms. (1) all negative currents are currents out the chip. 1999 apr 20 10 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 limiting values in accordance with the absolute maximum rating system (iec 134); unless noted all voltages are measured with respect to pin gnd. notes 1. repetitive clamped inductive turn-off energy <15 mj. 2. single pulse avalanche energy at t j <25 c: 570 mj. 3. equivalent to discharging a 100 pf capacitor through a 1.5 k w resistor. 4. equivalent to discharging a 200 pf capacitor through a 0.75 mh coil. thermal characteristics quality specification in accordance with snw-fq-611 part e . symbol parameter conditions min. max. unit v i(max) maximum dc input voltage - 600 v during inductive turn-off; note 1 - 720 v i d supply current - 7a v oob mode detect input voltage - 0.3 +14 v i oob mode detect input current -+ 2ma i demag demagnetization input current - 1ma v ctrl feedback input voltage - 0.3 +5 v v lsense current sense input voltage - 0.3 +5 v i ref reference input current -- 1ma v aux auxiliary supply voltage - 0.3 +18 v t j operating junction temperature - 10 +140 c t stg storage temperature - 40 +150 c v es electrostatic handling voltage class 2 human body model; note 3 - 2500 v machine model; note 4 - 250 v symbol parameter value unit ic controller r th(j-a) thermal resistance from junction to ambient 70 k/w r th(j-c) thermal resistance from junction to case 31 k/w power fet r th(j-a) thermal resistance from junction to ambient 37 k/w r th(j-c) thermal resistance from junction to case 0.85 k/w 1999 apr 20 11 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 characteristics t j = - 10 to +110 c; v in = 300 v; v aux = 8.6 to 13 v; r iref = 24.9 k w 0.1%; all currents into the chip are positive and all currents out of the chip are negative; all voltages are measured with respect to ground. symbol parameter conditions min. typ. max. unit input voltage and current on pin 9 v dlow minimum start drain voltage 100 -- v i in input current normal operation 20 60 100 m a i in(off) off mode current v oob < 1.95 v 150 350 550 m a start-up current source and vaux management on pin 2 v start start-up voltage 10.4 11 11.6 v v uvlo under voltage lockout 7.4 8.05 8.6 v v hys operation voltage hysteresis v start -v uvlo 2.60 2.95 3.30 v i start(low) start-up current 0 v < v aux < 0.5 v - 270 - 230 - 190 m a i start(high) start-up current 0.5 v < v aux 1999 apr 20 13 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 fig.8 normalised power derating. handbook, halfpage 0 40 80 160 160 120 40 0 80 mgr937 120 t case ( c) p (w) fig.9 junction capacitance. handbook, halfpage 10 3 10 2 10 mgr939 11010 2 10 3 v ds (v) c j (pf) coss handbook, halfpage - 80 3 2 1 0 0 160 80 mgr938 t j ( c) a fig.10 normalised drain-to-source on-state resistance. a = r ds(on) /r ds(on) at 25 c. i d = 6.2 a; v aux >10v. fig.11 normalised drain-to-source breakdown voltage. handbook, halfpage - 100 0 100 200 1.2 1 0.9 1.1 mgr940 t j ( c) a 1999 apr 20 14 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 fig.12 clamped inductive test circuit. handbook, full pagewidth mgr941 TEA1566 current sensing circuit clamp circuit vaux vin l i max isense closed i vc v s open vctrl dem gnd v s = 50 v; i max =7a v dem = 0.5 v; v aux =11v i vc = 6 ma; v clamp = 720 v l = 25 mh application information a converter using the greenchip ? is usually a flyback or a buck converter that is made up of the emi filter, full bridge rectifier, filter capacitor, transformer, output stage(s), and some snubber circuitry. depending upon the type of feedback used, either an auxiliary winding (primary regulation) or an opto-coupler (secondary regulation) is used. greenchip ? , due to its high level of integration uses very few external components. a sense resistor converts the primary current into a voltage on pin isense. the ic uses this information for setting the peak current in the converter. a capacitor supplied by an auxiliary winding buffers the internal supply of the ic and is connected on pin vaux. the auxiliary winding is also used for primary mode output voltage regulation. a resistor connected on pin iref sets the reference currents in the ic. a small capacitor (0.2 to 2 nf) connected on pin vctrl is used by the internal sample and hold circuit for regulation in primary feedback scheme. the same pin is also used for secondary sensing and serves as the input for the signal from the opto-coupler. pin gnd is the ground connection pin. the primary side auxiliary winding is connected via a resistor to pin dem. besides being used for demagnetization protection, pin dem is also used for primary side regulation. pin obb is a multi use pin and depending upon connection can be used for implementation of the on/off/burst mode functions. pin 8 is not connected and serves as a high voltage spacer pin. pin vin is the connection for the drain of the internal power mosfet and is a high voltage pin. the internal start-up current source also uses this pin as a supply for charging up the vaux capacitor during start-up and safe-restart modes. greenchip ? is a versatile ic that can be used in flyback and buck converter topologies and can be configured to work in different modes. the application diagrams on the next pages give some examples. for additional information also see: application note an98011: 200 w smps with tea1504 application note an98058: 75 w smps with TEA1566 . 1999 apr 20 15 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 fig.13 typical flyback configuration with secondary sensing and on/off feature. handbook, full pagewidth mgr697 TEA1566 mains 9 8 7 6 5 4 3 2 1 output s1 r ctrl c aux r sense r ref r dem r oob c ref vin nc oob dem gnd vctrl iref vaux isense 1999 apr 20 16 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 fig.14 flyback configuration using the burst mode stand-by, muvlo and on/off features. handbook, full pagewidth mgr698 TEA1566 mains r1 r2 s1 s2 9 8 7 6 5 4 3 2 1 output microcontroller supply from microcontroller r3 v z vin nc oob dem gnd vctrl iref vaux isense 1999 apr 20 17 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 fig.15 typical buck configuration with primary sensing. handbook, full pagewidth mgr699 TEA1566 mains 9 8 7 6 5 4 3 2 1 output vin nc oob dem gnd vctrl iref vaux isense fig.16 typical buck configuration with secondary sensing. handbook, full pagewidth mgr700 TEA1566 mains 9 8 7 6 5 4 3 2 1 output vin nc oob dem gnd vctrl iref vaux isense 1999 apr 20 18 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 package outlines unit a b max. b p 2 cd (1) e (1) z (1) de d h l j references outline version european projection issue date iec jedec eiaj mm 4.6 4.2 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 3.4 3.1 a max. 1 2.0 e h 6 2.00 1.45 2.1 1.8 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 17.2 16.5 sot131-2 92-11-17 95-03-11 0 5 10 mm scale q 0.25 w 0.03 x d l a e c a 2 q w m b p d d z e x h 19 e h non-concave seating plane 1 b j sil9p: plastic single in-line power package; 9 leads sot131-2 view b : mounting base side b 1999 apr 20 19 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 unit a a e 1 2 b p cd (1) e (1) z (1) de d h ll 3 m references outline version european projection issue date iec jedec eiaj mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 5.08 12.2 11.8 2.54 e 2 5.08 2.4 1.6 e h 6 2.00 1.45 0.8 3.4 3.1 4.3 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 12.4 11.0 sot157-2 0 5 10 mm scale v 2.1 1.8 q j 0.25 w 0.03 x d l e a c a 2 l 3 q w m b p 1 d d z e e x h 19 j e h non-concave 95-03-11 97-12-16 dbs9p: plastic dil-bent-sil power package; 9 leads (lead length 12 mm) sot157-2 b view b : mounting base side m 2 e v m 1999 apr 20 20 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 soldering introduction to soldering through-hole mount packages this text gives a brief insight to wave, dip and manual soldering. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). wave soldering is the preferred method for mounting of through-hole mount ic packages on a printed-circuit board. soldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. suitability of through-hole mount ic packages for dipping and wave soldering methods note 1. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. package soldering method dipping wave dbs, dip, hdip, sdip, sil suitable suitable (1) data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. 1999 apr 20 21 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 notes 1999 apr 20 22 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 notes 1999 apr 20 23 philips semiconductors preliminary speci?cation greenchip ? ; smps module TEA1566 notes internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1999 sca63 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy printed in the netherlands 295002/50/01/pp24 date of release: 1999 apr 20 document order number: 9397 750 03312 |
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